Semiconductor Laser Packaging Technology: Thermal Management, Optical Performance Enhancement and Reliability Studies

Abstract

This review article presents a comprehensive and in-depth discussion of thermal management, optical performance enhancement, and reliability issues in semiconductor laser packaging technology. By synthesising existing literature and research results, the article presents a systematic summary of the research progress and practical applications of semiconductor laser packaging technology in these key areas. In the section on thermal management, the article reviews different heat sink technologies, packaging structures, and solid crystal materials with the aim of improving the thermal stability and long-term reliability of semiconductor la ser devices. In the section on optical performance enhancement, the article outlines beam shaping techniques and packaging technologies. It also addresses reliability issues in packaging, discussing optical mirror damage as well as stress and mechanical damage. The aim of this review is to provide assistance for the further development and application of semiconductor laser packaging technology, with the objective of promoting the rapid and healthy development of the laser industry.

Received: 1 April 2024 | Revised: 18 September 2024 | Accepted: 18 November 2024

Conflicts of Interest

The authors declare that they have no conflicts of interest to this work.

Data Availability Statement

Data are available from the corresponding author upon reasonable request.

Author Contribution Statement

Tianqi Wu: Conceptualization, Methodology, Software, Validation, Formal analysis, Investigation, Resources, Data curation, Writing - review & editing, Supervision. Jichen Shen: Resources, Data curation, Writing - original draft. Jun Zou: Visualization. Peng Wu: Project administration, Funding acquisition. Yitao Liao: Project administration, Funding acquisition.