Editor-in-Chief: Babak Safaei, Department of Mechanical Engineering, Eastern Mediterranean University, Cyprus
Frequency: Quarterly
Submission to First Decision: 19 days
Submission to Acceptance: 108 days
Accept to Publish: 22 days
Acceptance Rate: 4%
eISSN: 2972-4325
© 2026 Bon View Publishing Pte Ltd.
Call for Papers-SI on AIISP
Special Issue on Artificial Intelligence and Intelligent Signal Processing for Neuroengineering, Biomedical Systems, and Smart Sensing Applications
Aims and Scope
Recent advances in artificial intelligence, machine learning, embedded intelligence, and sensing technologies are transforming the fields of neuroengineering, biomedical systems, and smart industrial applications. The increasing availability of multimodal physiological signals, wearable sensors, edge-computing platforms, and intelligent cyber-physical systems has created unprecedented opportunities for developing innovative solutions for healthcare, rehabilitation, human-machine interaction, and industrial automation. This Special Issue aims to bring together researchers, engineers, and practitioners working on advanced signal processing, machine learning, and intelligent sensing technologies. Particular emphasis will be placed on methods for analyzing complex biological and engineering signals. These may include, but are not limited to the following signals: electroencephalography (EEG), electromyography (EMG), and electrocardiography (ECG). The study and analysis of al other neurological and physiological signals are welcome. The focus is on multimodal sensor fusion, novel signal processing techniques and real-time embedded intelligence.
The Special Issue welcomes contributions that address theoretical developments, algorithmic innovations, system implementations, and practical applications. Topics spanning deep learning, explainable AI, edge AI, digital healthcare, wearable devices, robotics, mechatronic systems, brain-computer interfaces, and intelligent monitoring systems are particularly encouraged. By fostering interdisciplinary collaboration among researchers from engineering, computer science, neuroscience, and healthcare domains, this Special Issue seeks to highlight emerging trends and future directions that will shape the next generation of intelligent biomedical and engineering systems.
Lead Guest Editor

Ravi Suppiah
Higher Colleges of Technology, United Arab Emirates
Research Areas: Artificial Intelligence, Machine Learning, Deep Learning, Intelligent Systems, Signal Processing, Biomedical Signal Analysis, EEG and EMG Analytics
Guest Editors

Noori Kim
Purdue University, United States
Research Areas: Hearing Mechanics, Future Healthcare, MEMS, Electromagnetics, Acoustics, Embedded Systems (IoT)

Qiaowei Yuan
Tohoku Institute of Technology, Japan
Research Areas: Electromagnetic Waves, Wireless Communication, Wireless Power Transfer
Special Issue Information
The contributions from researchers describing their original, unpublished, research contribution on the following theme (but not limited to):
- Machine learning for biomedical signal processing
- Deep learning for neurological signal analysis
- Brain-computer interface systems
- Neuroengineering and neural data analytics
- Multimodal physiological signal fusion
- Wearable health monitoring technologies
- Intelligent sensing and smart sensor systems
- Edge AI and embedded intelligence
- Human-machine interaction systems
- Robotics and mechatronic healthcare applications
Manuscript Submission Information
Submission deadline: 31st December 2026
Submissions that pass pre-check will be reviewed by at least two reviewers of the specific field.
If you have any queries regarding this special issue or other matters, please feel free to contact the editorial office: aaes@bonviewpress.com