Wu, TianQi, Jichen Shen, Jun Zou, Peng Wu, and Yitao Liao. “Semiconductor Laser Packaging Technology: Thermal Management, Optical Performance Enhancement and Reliability Studies”. Journal of Optics and Photonics Research (November 26, 2024). Accessed December 22, 2024. https://ojs.bonviewpress.com/index.php/JOPR/article/view/2985.