WU, Tianqi; SHEN, Jichen; ZOU, Jun; WU, Peng; LIAO, Yitao. Semiconductor Laser Packaging Technology: Thermal Management, Optical Performance Enhancement, and Reliability Studies. Journal of Optics and Photonics Research, [S. l.], v. 3, n. 1, p. 01–18, 2026. DOI: 10.47852/bonviewJOPR42022985. Disponível em: https://ojs.bonviewpress.com/index.php/JOPR/article/view/2985. Acesso em: 22 mar. 2026.